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Insulating material needs to provide sufficient electrical isolation. Any violation of minimum electrical clearance is a defect condition for all classes High Voltage The term high voltage will vary by design and application. It is necessary that users of this standard pay particular attention to the subject of each section to avoid misinterpretation. The inspector does not select the class for the assembly under inspection, see 1.
Documentation that specifies the applicable class for the assembly under inspection shall be provided to the inspector. Automated Inspection Technology AIT is a viable alternative to visual inspection and complements automated test equipment. Many of the characteristics in this document can be inspected with an AIT system. If the customer desires the use of industry standard requirements for frequency of inspection and acceptance, J-STD- is recommended for further soldering requirement details.
All dimensions in this standard are expressed in SI System International units with Imperial English equivalent dimensions provided in brackets. All specified limits in this standard are absolute limits as defined in ASTM E Magnification Aids For visual inspection, some individual specifications may call for magnification aids for examining printed board assemblies.
Magnification aids, if used for inspection shall be appropriate with the item being inspected. Unless magnification requirements are otherwise specified by contractual documentation, the magnifications in Table and Table are determined by the item being inspected. Referee conditions are used to verify product rejected at the inspection magnification power. For assemblies with mixed land widths, the greater magnification may be used for the entire assembly.
Note 1: Visual inspection may require the use of magnification, e. Note 2: If magnification is used it is limited to 4X maximum. Lighting shall be adequate for the item being inspected. Light sources should be selected to prevent shadows. Note: In selecting a light source, the color temperature of the light is an important consideration. Light ranges from K enable users to distinguish various printed circuit assembly features and contaminates with increased clarity.
New or changed text are shown in blue and underlined like this. Deleted or moved text is shown in red and strikethrough. Section No. IPC is a not-for-profit association for. The contents for this script were developed by a review group of industry experts and were based on the best available.
The contents for this script were developed by a review group of industry. IPC is a not-for-profit association for the electronics. These connectors are designed for use in pluggable. As methods and processes change it will be updated accordingly. It is intended only as an introduction to the production.
This test consists of thirty multiple-choice questions. Use the supplied Answer Sheet and circle the letter. This test consists of twenty multiple-choice questions.
Each question has only one most correct answer. Use the Answer Sheet and circle. There are 2 reasons why Inspection is performed: o To verify the. Flex Circuit Design and Manufacture. In some cases, the problem occurs.
Preface xiii Introduction xv 1 Planning for surface mount design General electronic products 3 Dedicated service electronic products 3 High-reliability electronic products 4 Defining the environmental.
PCB inspection is more important today than ever before! Industry experts continue to stress the need to inspect hidden solder joints! Figure 1. The BGA package has not been placed into the paste deposit. Deleted or moved text is shown in red and.
The connectors have an in row contact spacing on 0. APP Rev 03 This application note is intended to give a person involved in the manufacturing engineering of a typical XFP module an overview of the procedures and requirements for soldering an OEpic.
Understanding the process variations. The contents for this script were developed by a review group of industry experts and were based on the best. A way of attaching electronic components to a printed circuit board The solder joint forms the mechanical and electrical connection What is surface mount? Bonding of the solder joint is to the surface. Back to top. Get to Know Us. Make Money with Us. Amazon Payment Methods.
Zohreh Bagheri. Raiyo Aspandiar. Ross Wilcoxon. Nathan Blattau. Ioan Plotog. Cheryl Tulkoff. Stephan Meschter. Jerry Gleason. Marianne Romansky. Charlie Han. Log in with Facebook Log in with Google. Remember me on this computer. Enter the email address you signed up with and we'll email you a reset link. Need an account? Etched Including Hand Printing Bar Coding Adhesion and Damage A-1 Index This document presents acceptance requirements for the manufacture of electrical and electronic assemblies.
Historically, electronic assembly standards contained a more comprehensive tutorial addressing principles and techniques. Users of this standard should be knowledgeable of the applicable requirements of the document and how to apply them. Objective evidence of the demonstration of this knowledge should be maintained.
Where objective evidence is unavailable, the organization should consider periodic review of personnel skills to determine visual acceptance criteria appropriately.
Table is a summary of related documents. IPC-AJ is a supporting document that provides information regarding the intent of this specification content and explains or amplifies the technical rationale for transition of limits through Target to Defect condition criteria.
In addition, supporting information is provided to give a broader understanding of the process considerations that are related to performance but not commonly distinguishable through visual assessment methods. Summary of Related Documents Spec. Component and Assembly Process Guidelines to assist in the design of the bare board and the assembly where the bare board processes concentrate on land patterns for surface mount and the assembly concentrates on surface mount and through-hole principles which are usually incorporated into the design process and the documentation.
End Item Documentation IPC-D Documentation depicting bare board specific end product requirements designed by the customer or end item assembly requirements.
End Item Standards IPC J-STD Requirements for soldered electrical and electronic assemblies depicting minimum end product acceptable characteristics as well as methods for evaluation test methods , frequency of testing and applicable ability of process control requirements.
Training Programs Optional Rework and Repair Documented training requirements for teaching and learning process procedures and techniques for implementing acceptance requirements of either end item standards, acceptability standards, or requirements detailed on the customer documentation.
The explanations provided in IPC-AJ should be useful in determining disposition of conditions identified as Defect, processes associated with Process Indicators, as well as answering questions regarding clarification in use and application for defined content of this specification. The customer user has the ultimate responsibility for identifying the class to which the assembly is evaluated.
If the user and manufacturer do not establish and document the acceptance class, the manufacturer may do so. If the assembly does not comply with these or with equivalent requirements, the acceptance criteria shall be defined between the customer and supplier. The illustrations in this document portray specific points noted in the title of each page.
A brief description follows each illustration. All the downloads require Acrobat Reader click here to download the latest version IPC Specification Tree Using this guide you can ensure that you have all the specifications you need. Pen and ink changes should be made in accordance with your company's document control policies.
Amendment 1 addresses Telcordia Technologies' formerly Bellcore's position towards this standard. It calls out newly revised test methods and updated requirements for formulation change. IPC Voluntary Safety Standard for Electrically Heated Process Equipment This voluntary standard establishes minimum requirements for the design, installation, operation and maintenance of electrically heated process equipment in order to minimize electrical hazards and prevent fires that may occur in combustible tanks, tank liners and drying equipment.
Download IPC Kb. IPC Amendment 1 Generic Standard on Printed Board Design The January release of Amendment 1 for the IPC standard provides expanded coverage of plated-through hole test specimens in addition to a new test specimen for the purpose of evaluating bending flexibility and endurance for flexible printed wiring applications. This amendment also includes updated figures for etched conductor characteristics and printed board size standardisation. Includes information on conformance to both fabricator and customer design rules and can be used by printed board designers as an output quality check.
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